Accelerating Artificial Intelligence and Leading Efficiency
Engineering richer features in a revolutionary platform, Intel has made an incredible jump in processor performance in the business transformation journey. AI and deep learning performance will benefit from the built-in AI acceleration engines, while networking, storage, and analytics leverage other specialized accelerators in the 4th & 5th Gen Intel Xeon Scalable processors. Adding a host of new features to target a wide range of workloads, the new families of Intel Xeon processors will deliver even better CPU performance and performance per watt, and do so on a PCIe 5.0 platform with 2x the prior gen throughput to greatly speed up data movement to and from GPUs and storage. Intel also created the Intel Xeon CPU Max Series with High Bandwidth Memory (HBM) for improvements in memory bound HPC and AI workloads. For this new platform, GIGABYTE has products ready to get the most out of Intel Xeon CPU-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory.
Redefine Performance with 4th/5th Gen Intel Xeon Scalable Processors and Intel Xeon CPU Max Series
Select GIGABYTE for the latest Gen Intel Xeon Platform
H263-S67-AAW1 Product Overview
H263-S67-AAW1 Block Diagram
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Power Efficiency
Automatic Fan Speed Control
GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.
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Cold Redundancy
To take advantage of the fact that a PSU will run at greater power efficiency with a higher load, GIGABYTE has introduced a power management feature called Cold Redundancy for servers with N+1 power supplies. When the total system load falls lower than 40%, the system will automatically place one PSU into standby mode, resulting in a 10% improvement in efficiency.
Gigabyte High Density Server H263-S67-AAW1
High Density Server – 5th/4th Gen Intel® Xeon® Scalable – 2U 4-Node DP 8-Bay Gen5 NVMe/SATA/SAS-4 3000W
- 2U 4-node rear access server system
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
- Dual Intel® Xeon® CPU Max Series per node
- 8-Channel DDR5 RDIMM, 64 x DIMMs
- Dual ROM Architecture
- 1 x CMC port
- 8 x 2.5″ Gen5 NVMe/SATA/SAS-4 hot-swappable bays
- 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
- 4 x LP PCIe Gen5 x16 slots
- 4 x OCP 3.0 Gen5 x16 slots
- Dual 3000W 80 PLUS Titanium redundant power supply
| Dimensions (WxHxD, mm) | Expansion Slots | Power Supply |
| 2U 4-Node – Rear access | Per node: | Dual 3000W 80 PLUS Titanium redundant power supply |
| 440 x 87.5 x 840 | Riser Card CRSH01U: | Available for 2+1 redundant power supply configuration (optional) |
| Motherboard | – 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0 | |
| MS63-HD1 | AC Input: | |
| CPU | 1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0 | – 100-127V~/ 16A, 50/60Hz |
| 5th Generation Intel® Xeon® Scalable Processors | Supports NCSI function | – 200-207V~/ 16A, 50/60Hz |
| 4th Generation Intel® Xeon® Scalable Processors | – 208-240V~/ 16A, 50/60Hz | |
| Dual processor per node, TDP up to 270W | Optional 1 x M.2 slot (CMTP061): | |
| – M-key | DC Input: (Only for China) | |
| Supports TDP up to 350W with no support on OCP slot at ambient 35°C. | – PCIe Gen4 x4, from CPU_1 | – 240Vdc/ 16A |
| – Supports 2280/22110 cards | ||
| Supports TDP up to 350W at ambient 30°C. | DC Output: | |
| Total: | – Max 1200W/ 100-127V~ | |
| Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable. | Riser Card CRSH01U x 4: | #ERROR! |
| Socket | – 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0 | #ERROR! |
| Per Node: | – Max 2600W/ 200-207V~ | |
| 2 x LGA 4677 | 4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0 | #ERROR! |
| Support NCSI function | #ERROR! | |
| Total: | – Max 3000W/ 208-240V~ or 240Vdc Input | |
| 8 x LGA 4677 | Optional 4 x M.2 slots (CMTP061): | #ERROR! |
| – M-key | #ERROR! | |
| Socket E | – PCIe Gen4 x4, from CPU_1 | |
| Chipset | – Support 2280/22110 cards | Note: The system power supply requires C19 power cord. |
| Intel® C741 | Internal I/O | System Management |
| Memory | Per node: | Aspeed® AST2600 management controller |
| Per node: | 1 x TPM header | GIGABYTE Management Console (AMI MegaRAC SP-X) web interface |
| 16 x DIMM slots | 1 x VROC connector | |
| Front I/O | Dashboard | |
| Total: | Per node: | HTML5 KVM |
| 64 x DIMM slots | 1 x Power button with LED | Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.) |
| 1 x ID button with LED | Sensor Reading History Data | |
| DDR5 memory supported only | 1 x Reset button | FRU Information |
| 8-Channel memory architecture | 1 x System status LED | SEL Log in Linear Storage / Circular Storage Policy |
| RDIMM up to 96GB supported | Hardware Inventory | |
| 3DS RDIMM up to 256GB supported | Total: | Fan Profile |
| 4 x Power buttons with LED | System Firewall | |
| 5th Gen Intel® Xeon®: Up to 5600 MT/s | 4 x ID buttons with LED | Power Consumption |
| 4th Gen Intel® Xeon®: Up to 4800 MT/s | 4 x Reset buttons | Power Control |
| Intel® Xeon® Max Series: Up to 4800 MT/s | 4 x System status LEDs | Advanced power capping |
| LAN | *1 x CMC status LED | LDAP / AD / RADIUS Support |
| Per node: | *1 x CMC reset button | Backup & Restore Configuration |
| 1 x 10/100/1000 Mbps Management LAN | Remote BIOS/BMC/CPLD Update | |
| *Only one CMC status LED and reset button per system. | Event Log Filter | |
| Total: | Rear I/O | User Management |
| 4 x 10/100/1000 Mbps Management LAN | Per node: | Media Redirection Settings |
| *1 x CMC port | 2 x USB 3.2 Gen1 | PAM Order Settings |
| 1 x VGA | SSL Settings | |
| *Please refer to optional parts for ring topology support. | 1 x MLAN | SMTP Settings |
| 1 x ID button with LED | OS Compatibility | |
| Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology. | Please refer to OS compatibility table in support page | |
| Video | Total: | System Fans |
| Integrated in Aspeed® AST2600 | 8 x USB 3.2 Gen1 | 4 x 80x80x80mm (16,500rpm) |
| 2D Video Graphic Adapter with PCIe bus interface | 4 x VGA | Operating Properties |
| 1920×1200@60Hz 32bpp | 4 x MLAN | Operating temperature: 10°C to 35°C |
| 4 x ID buttons with LED | Operating humidity: 8-80% (non-condensing) | |
| Management chip on CMC board: | *1 x CMC port | Non-operating temperature: -40°C to 60°C |
| Integrated in Aspeed® AST2520A2-GP | Non-operating humidity: 20%-95% (non-condensing) | |
| Storage | *Only one CMC port per system. | Packaging Dimensions |
| Per node: | Backplane Board | 1180 x 779 x 300 mm |
| 2 x 2.5″ Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1 | Speed and bandwidth: | Packaging Content |
| PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s | 1 x H263-S67-AAW1 | |
| Total: | TPM | 8 x CPU heatsinks |
| 8 x 2.5″ Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1 | 1 x TPM header with SPI interface | 24 x Carriers |
| – Optional TPM2.0 kit: CTM010 | 1 x 3-Section Rail kit | |
| SAS card is required for SAS devices support | Part Numbers | |
| SAS | – Barebone package: 6NH263S67DR000ABW1* | |
| Depends on SAS add-in cards | – Motherboard: 9MS63HD1UR-000 | |
| RAID | – 3-Section Rail kit: 25HB2-A66125-K0R | |
| Intel® SATA RAID 0/1/10/5 | – CPU heatsink: 25ST1-453200-A0R/25ST1-453208-C1R | |
| – Front panel board – CFPH004: 9CFPH004NR-00 | ||
| – Backplane board – CBPH081: 9CBPH081NR-00 | ||
| – Fan module: 25ST2-888020-S1R | ||
| – Riser card – CRSH01U: 9CRSH01UNR-00 | ||
| – LAN board – CLBH010: 9CLBH010NR-00 | ||
| – Power supply: 25EP0-230009-L0S | ||
| Optional parts: | ||
| – C19 power cord 125V/15A (US): 25CP1-018000-Q0R | ||
| – C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R | ||
| – C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R | ||
| – M.2 riser card – CMTP061: 9CMTP061NR-00 | ||
| – Ring topology kit (10-kit package): 6NH263S62S1000AAN11 | ||
| – RMA packaging: 6NH263S67SR-RMA-A100 |
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
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